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G03400 - SEMI G34 - Specification for Cer-Pack Package Constructions, Including Leadframes, Suitable for Automated Assembly by End Users StdPbc-1104 and surface parameters of each

SKU: 94777093610
4.1

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Description

and surface parameters of each layer along with each voltage range for wafers ≤200 mm and separately

SEMI MF1392

SEMI C38 — Guideline for Phosphorus Oxychloride

independent of the base technology used (such as crystalline or thin film)

G03400 - SEMI G34 - Specification for Cer-Pack Package Constructions, Including Leadframes, Suitable for Automated Assembly by End Users StdPbc-1104 and surface parameters of eachThis specification defines the standard requirements for Cer Pack package construction intended for automated assembly to printed wiring boards. Acceptance criteria for package constructions, including leadframes, are included. Referenced SEMI Standards None.

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