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は，公式でなく，参考値である。また，SI値の正確な変換値でない場合もある。
SEMI E87-0709 (technical revision)
production and sale for light emitting diode (LED) industry
The scope of this Standard is limited to identifying key EQIPs for select equipment process types
3D02000 - SEMI 3D20 - Specification for Panel Characteristics for Panel Level Packaging (PLP) Applications StdPbc-0923 は，公式でなく，参考値である。また，SI値の正確な変換値でない場合もある。Panel level packaging (PLP) is projected to become a critical packaging process. This Specification identifies the physical properties that must be specified for the semiconductor industry to produce an equipment set for successful implementation of PLP. Many of the applications for panel packaging lines include fan out technology applications. To permit common processing equipment, standardized panel (largest external) dimensions (whether with or
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