F05200 - SEMI F52 - 半導体及びFPD製造の薬液供給システム用メトリックPFAチューブの寸法仕様 Revision:SEMI F52-1101 - Inactive and post-process equipment for semiconductor

and post-process equipment for semiconductor processes using energetic materials

3  These methods are destructive

and doped polysilicon—are displaying characteristics that are unacceptable for upcoming technology nodes

while polished wafers may exhibit several forms of crystallographic defects or surface damage

F05200 - SEMI F52 - 半導体及びFPD製造の薬液供給システム用メトリックPFAチューブの寸法仕様 Revision:SEMI F52-1101 - Inactive and post-process equipment for semiconductorNOTICE: This translation is a REFERENCE COPY ONLY. If differences should exist between the English version and a translation in any other language, the English version is the official and authoritative version. SEMI SEMI Global Liquid Chemical Distribution Systems Committee200011420018www. semi. org20011120006 NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive