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SEMI E125-0307 (technical revision)
wafers ground with edge-follower edge rounding equipment may be elliptically shaped
SEMI D6-0211 (Reapproved 0117)
This Test Method covers the direct measurement of the average sheet resistance of thin layers of silicon formed by epitaxy
G04300 - SEMI G43 - Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages Revision:SEMI G43-0519 - Inactive SEMI E125-0307 (technical revision)The purpose of this test is to determine the thermal resistance of molded plastic packages using thermal test chips. This Test Method deals only with junction to case measurements of thermal resistance and limits itself to fluid bath testing environments. For this test, conduction through the leads is minimized, thus providing information on the ability of the plastic package material to dissipate heat. This Test Method should only be used for
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