PV04100 - SEMI PV41 - Test Method for In-Line, Noncontact Measurement of Thickness and Thickness Variation of Silicon Wafers for PV Applications Using Capacitive Probes Revision:SEMI PV41-0912 (Reapproved 0419) - Current This Specification defines communication and

This Specification defines communication and behavior between the production equipment and each subsystem to facilitate energy saving mode operation or sleep level management

It does not address specific test methods or procedures for performance verification

3 — Specification for Web Services for Substrate Mapping

and the existing standards for performing these tests are referenced

PV04100 - SEMI PV41 - Test Method for In-Line, Noncontact Measurement of Thickness and Thickness Variation of Silicon Wafers for PV Applications Using Capacitive Probes Revision:SEMI PV41-0912 (Reapproved 0419) - Current This Specification defines communication andWafer thickness and its variation across a wafer are important parameters for solar cell manufacturing. Excessive thickness variations within a lot from wafer to wafer or within a wafer may negatively impact process yield and solar cell efficiency. Both parameters are part of the specification for solar cell wafers (SEMI PV22), which define a thickness range as well as an upper limit for the total thickness variation (TTV). In addition, careful