G06900 - SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds StdPbc-1019 Anomalies may be examined using

Anomalies may be examined using review equipment

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This edition was approved for publication by the global Audits and Reviews Subcommittee on June 4

SEMI D38-0723 (technical revision)

G06900 - SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds StdPbc-1019 Anomalies may be examined usingThis Standard describes procedures for measuring adhesive strength between leadframes and molding compounds for semiconductor packages. The procedures include shear test, pull test, and three point bending techniques. This Standard may be used on all types of semiconductor leadframe and molding compound. The methods help leadframe manufacturers, molding compound manufacturers and their customers in evaluating leadframes, and molding compounds as a