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G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding Revision:SEMI G73-0997 (Reapproved 1104) - Superseded SEMI E18 — Guide for

SKU: 27956483449
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Description

SEMI E18 — Guide for Temperature Specifications of the Mass Flow Controller

of fiducial notches on silicon wafers fall within specified limits

This procedure applies only to large scale bulk purifiers rated at greater than 50 liters-per-minute (LPM) flow rate

A request for information and the corresponding data transmission is an example of such an activity

G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding Revision:SEMI G73-0997 (Reapproved 1104) - Superseded SEMI E18 — Guide forThis Standard defines the pull strength test method for wire bonding. Referenced SEMI Standards None.

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