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in some cases
orgで入手可能となる。初版は2006年7月発行。
6-0703 (first published)
and trace data from semiconductor equipment through the use of a named data collection plan
M06600 - SEMI M66 - Test Method to Extract Effective Work Function in Oxide and High-K Gate Stacks Using the MIS Flat Band Voltage-Insulator Thickness Technique Revision:SEMI M66-0706E - Superseded in some casesContinued scaling of CMOS integrated circuit dimensions is reaching a point where materials changes as well as lithographic advances are required to meet the projections of Moores Law and the International Technology Roadmap for Semiconductors. As gate dielectric thickness approaches 1 nm, both the gate dielectric and electrode materials that have been in common usageSiO2, and doped polysiliconare displaying characteristics that are unacceptable for
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