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and Sub-Assembly for High Purity Piping Systems and Final Assembly for Semiconductor Manufacturing Equipment
References are cited
1-0308 (technical revision)
SEMI C27-0699 (first published - replaces SEMI C1
E12000 - SEMI E120 - COMMON EQUIPMENT MODEL 사양 StdPbc-0823 and Sub-Assembly for High PurityThis Standard was technically approved by the Information & Control Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on December 23, 2013. Available at www. semiviews. org and www. semi. org in April 2014; originally published March 2003; previously published March 2010. The purpose of this Specification is to provide a generally applicable object model of semiconductor equipment
