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The constraints of the second procedure must be checked before applying it
Dynamic Method — In which the test is conducted under level 2 variability conditions (with removing the wafer from and reloading it to the stage of the SSIS between scans)
Due to the lack of adequate on-line particle detection metrology at the particle sizes addressed by this Guide
This Test Method covers calculation of near-edge curvature ZDD (radial double derivative of z [height])
G06200 - SEMI G62 - 銀めっきの試験方法 StdPbc-0703 The constraints of the secondglobal Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org199520023 : Referenced SEMI Standards SEMI G55 Test Method for Measurement of Silver Plating Brightness SEMI G56 Test Method for Measurement of Silver Plating Thickness
